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1、Adhesion附著力AnnularRing孔環(huán)AOI（automaticopticalinspection）自動光學(xué)檢測AQL（acceptablequalitylevel）可接受的質(zhì)量等級B²；it(buriedbumpinterconnectiontechnology）埋入凸塊焊點(diǎn)互連技術(shù)BBH(buriedblindhole)埋盲孔BGA（ballgridarray）球柵陣列Blister起泡BoardEdges板邊Burr毛頭/毛刺BUM（Build-upmultilayer)積層式多層板BVH(buried/blindviahole）埋/盲導(dǎo)通孔CAD(computerai

2、deddesign)計算機(jī)輔助設(shè)計CAM（computeraidedmanufacturing)計算機(jī)輔助制造Carbonoil碳油CEM（compositeepoxymaterial)環(huán)氧樹脂復(fù)合板材chamfer倒角Characteristicimpedance特性阻抗CNC（computerizednumericalcontrol）計算機(jī)化數(shù)字控制ConductorCrack導(dǎo)體破裂ConductorSpacing導(dǎo)線間距connector連接器Copperfoil銅箔（皮）Crazing微裂紋（白斑)Delamination分層Dewetting半潤濕(縮錫）DFM（designfor

3、manufacturing）可制造性設(shè)計DIP（dualin-linepackage）雙列直插式組件Dk(dielectricconstant）介電常數(shù)DRC(designrulechecking）設(shè)計規(guī)則檢查drawing圖紙ECN(engineeringchangenotice）工程更改通知ECO(engineeringchangeorder）工程更改指令Eglass電子級玻璃entekOSP處理Epoxyresin環(huán)氧樹脂ESD（electrostaticdischarge）靜電釋放EtchedMarking蝕刻標(biāo)記Flatness翹曲度ForeignInclusion外來夾雜物Flam

4、eresistant阻燃性FR-2(flame-retardant2）耐燃酚醛紙基板FR3(flame-retardant3)耐燃環(huán)氧紙基板FR4(flame-retardant4)耐燃環(huán)氧玻璃布基板FR-5(flame-retardant5)耐燃多功能環(huán)氧玻璃布基板ground地面(層）Haloing暈圈HDI（highdensityinterconnection)高密度互連技術(shù)HASL(hotairsolderleveling)熱風(fēng)焊料整平(整平)IC（integratedcircuits)集成電路InkStampedMarking蓋印標(biāo)記Insulationresistance絕緣電阻I

5、oncleanliness離子清潔度IPC(theinstituteforinterconnectingandpackagingofelectroniccircuits）印制電路互連與封裝協(xié)會ISO(Internationalorganizationforstandardization）國際標(biāo)準(zhǔn)化組織LaminateVoids壓合空洞laser激光LDI(laserdirectimaging)激光直接成像legend文字標(biāo)記、符號LiftedLands焊盤浮起logo標(biāo)志LPI（liquidphotoimageable）液態(tài)感光成像LPISM(liquidphotoimageablesolde

6、rmask)液態(tài)感光阻焊膜marking標(biāo)記Measling白斑M(jìn)icrovoids微坑mil密耳（千分之一英寸)MIL-STD（militarystandard）美國軍用標(biāo)準(zhǔn)NegativeEtchback欠蝕Nicks缺口Nodules鍍鎦Nonwetting不潤濕(拒錫)open開路OSP（organicsolderabilitypreservatives）表面抗氧化oxides氧化物pad焊盤panel拼板pattern板面圖形PCB(printedcircuitboard)印制電路板Pcs(pieces）件、片、只Peeling剝落pinhole針孔PinkRing粉紅圈Pits凹坑

7、pitch中心距PlatingVoids鍍層破洞plug塞PositiveEtchback過蝕power電源層prepreg半固化片PTFE（polytetrafluoroethylene)聚四氟乙烯PTH（platedthroughhole)金屬化孔PWB（printed-wiringboard）印制線路板Registration對準(zhǔn)QA(qualityassurance）質(zhì)量保證QC(qualitycontrol）質(zhì)量控制QE（qualityengineering）質(zhì)量工程QFP（quadflatpackage）方形扁平組件repair修理RCC（resincoatedcopper）已涂覆

8、樹脂的銅箔Referencedimension參考尺寸registration對準(zhǔn)度resin樹脂rejection拒收revision修訂版RF（radiofrequency)射頻Ripples紋路rout外形銑scratch劃傷ScreenedMarking綱印標(biāo)記scoring刻槽short短路signal信號Silkscreen絲網(wǎng)SkipCoverage漏印slot開槽SMD（surfacemountdevice)表面安裝器件SMOBC（soldermaskoverbarecopper)裸銅覆蓋阻焊膜SMT（surfacemounttechnology）表面安裝技術(shù)smear毛刺so

9、lder焊錫S/M(soldermask)綠油solderability可焊性SodaStrawing(汽水)吸管式浮空SPC（statisticalprocesscontrol）統(tǒng)計過程控制spacing間距Tapetest膠帶實(shí)驗(yàn)TCE（thermalcoefficientofexpansion)熱脹系數(shù)TDR（timedomainreflectometry）時域反射測試tolerance公差Tenting蓋孔TextureCondition顯布紋Tg（glasstransitiontemperature)玻璃軟化溫度THT(throughholetechnology)通孔(插裝）技術(shù)tr

10、ace線路（條）UL（underwriterslaboratories)安全實(shí)驗(yàn)所NPTH非金屬化孔UV(ultraviolet)紫外線輻射vcutV刻Viahole導(dǎo)通孔（過線孔）void空洞warp板彎Waves波浪WeaveExposure露織物wetting沾錫Wicking燈芯效應(yīng)（滲銅）Wrinkles起皺五、形狀與尺寸：1、導(dǎo)線（通道）：conduction(track)2、導(dǎo)線(體)寬度:conductorwidth3、導(dǎo)線距離：conductorspacing4、導(dǎo)線層:conductorlayer5、導(dǎo)線寬度/間距:conductorline/space6、第一導(dǎo)線層:co

11、nductorlayerno.17、圓形盤:roundpad8、方形盤：squarepad9、菱形盤:diamondpad10、長方形焊盤:rectanglepad11、子彈形盤：bulletpad12、淚滴盤:teardroppad13、雪人盤：snowmanpad14、v形盤:v-shapedpad15、環(huán)形盤：annularpad16、非圓形盤：noncircularpad17、隔離盤:isolationpad18、非功能連接盤：monfunctionalpad19、偏置連接盤:offsetland20、腹（背）裸盤：back-bardland21、盤址：anchoringspaur22

12、、連接盤圖形：landpattern23、連接盤網(wǎng)格陣列：landgridarray24、孔環(huán)：annularring25、元件孔:componenthole26、安裝孔：mountinghole27、支撐孔：supportedhole28、非支撐孔：unsupportedhole29、導(dǎo)通孔：via30、鍍通孔：platedthroughhole（pth)31、余隙孔：accesshole32、盲孔：blindvia(hole）33、埋孔:buriedviahole34、埋/盲孔：buried/blindvia35、任意層內(nèi)部導(dǎo)通孔：anylayerinnerviahole(alivh）36

13、、全部鉆孔:alldrilledhole37、定位孔：toalinghole38、無連接盤孔：landlesshole39、中間孔：interstitialhole40、無連接盤導(dǎo)通孔：landlessviahole41、引導(dǎo)孔：pilothole42、端接全隙孔:terminalclearomeehole43、準(zhǔn)表面間鍍覆孔:quasi-interfacingplated-throughhole44、準(zhǔn)尺寸孔：dimensionedhole45、在連接盤中導(dǎo)通孔：viainpad46、孔位：holelocation47、孔密度:holedensity48、孔圖：holepattern49、鉆孔圖：drilldrawing50、裝配圖：assemblydrawing51、印制板組裝圖:printedboardassemblydrawing52、參考基準(zhǔn)：datumreferance